T2540 4.2M Pixel 25 Gpx/s

The T2540 is a full frame 4.2M Pixel camera with 5,840 fps native frame rate

The T2540 is a 4.2 Mpx high-speed camera at 25Gpx/s throughput. The compact size and advanced workflow features makes this camera ideal for advanced motion analysis in any environment.

 

Overview

High-Speed 4.2M Pixel Camera

  • 2560 x 1664 pixel proprietary sensor
  • Advanced triggering, up to 256GB internal RAM
  • Frame rates from 100 to 277,770 fps
  • Interchangeable lens mounts (Nikon F, G, PL, C, Canon EOS)
  • Sensor binning for higher sensitivity, higher speed (monochrome output only)
  • Monochrome or colour sensors

The Phantom T2540 delivers the imaging power of the T4040 at 25Gpx/s for 5840 fps at full resolution. A peak Quantum Efficiency rating above 90% ensures the sensor’s ability to capture images at low light levels.

A major benefit of 4Mpx imaging is increased accuracy for tracking algorithms versus traditional 1Mpx high-speed images. The greater pixel resoution is well suited for techniques like Digital Image Correlation (DIC) and for impact studies it helps ensure accurate rendition of particle movement and shape.

The T2540 includes premium features to enable a variety of applications including:

  • Binned mode combines pixels to increase vertical resolution of the camera’s top frame rates at 1MPX and below. Available for color and mono, but output will switch to mono on a color camera.
  • EDR (Extreme Dynamic Range) provides mitigation for bright flashes by dynamically adjusting exposure in saturated areas of the image.
  • Programmable I/O to interface with DAQ systems and a variety of measurement sensors, which can be recorded and viewed as metadata in Cine files.
  • On-camera controls, video output and CineMag is available for remote, standalone operation.

Specifications

Sensor Proprietary 2560 x 1664 pixel BSI CMOS

EMVA 1288 measurements at 532nm

Dynamic Range 52-54.8 dB
Integration Time Down to 250 ns (FAST option)
Frame Rate
  • 5,840 @ 2560 x 1664 (Standard mode)
  • 6,330 @ 1536 x 1536 (Standard mode)
  • 23,250 @ 1280 x 832 (Standard binned mode)
  • 277,770 @ 1280 x 64 (HS binned mode)
  • (other speeds and resolutions available, please see datasheet)
Pixel Size 18.5 µm, 37µm binned mode
Standard Mode
  • Quantum Efficiency: 85.4% mono; 71% color
  • Max. SNR: 39.9 dB
  • AST (p) 28.4 mono; 37.1 color
  • Saturation Capacity (e-): 9703 mono; 11733 color
  • Temporal Dark Noise: 23.7 e-
Binned Mode
  • Quantum Efficiency: 82.4%
  • Max. SNR: 45.4 dB
  • AST (p) 76.2
  • Saturation Capacity (e-): 34684
  • Temporal Dark Noise: 62.2 e-
Internal Memory 64GB, 128GB, 256GB
Sensor Cooling TE Cooled
Max record time 6.9 sec at full resolution, max memory
Triggering
  • Programmable trigger location (pre/post trigger recording)
  • Image-Based Auto-Trigger
  • Trigger from software
  • Hardware trigger BNC
  • High Voltage (HV) trigger compatible
Exposure
  • 1.04 µs minimum exposure standard, 250 ns minimum exposure with FAST option (export controlled)
  • Global electronic shutter
  • Extreme Dynamic Range (EDR)
  • Auto Exposure
  • Exposure Index (E.I.) for controlling apparent ISO
  • Shutter Off mode for PIV
 Image Time Stamp
  • IRIG, SMPTE or MISP
  • IRIG in/out (modulated and unmodulated)
  • GPS
Signaling
  • Dedicated Trigger, Timecode In ports
  • Dedicated Remote port for RS232
  • Dedicated Range Data
  • 3 Programmable I/O ports includes adjustable (assign and define) signals including:
    • F-sync
    • strobe
    • event
    • trigger output
    • ready and more
Shutter Internal mechanical shutter for simple current session reference
Timing
  • Timing resolution < 20ns
  • Frame synchronization to internal or external clock (FSYNC)
Standard Video Output
  • 2X 3G HD-SDI ports
  • Micro-HDMI
  • Supports up to 1080p60
Lens Interface Nikon F, C, PL or Canon EOS
Camera Control
  • Phantom Camera Control (PCC)
  • SDK available
Data Acquisition National Instruments M- and X-Series DAQ modules with integrated support in PCC

Applications

Fluid dynamics
High-speed machining
Welding
Ballistic impacts
Micro-fluidics
Combustion
Additive Manufacturing
PIV
Explosion dynamics

Accessories

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